|
| |
 |
|
 |
|
|
|
|
|
|
 |
|
YES VACUUM BAKE/VAPOR PRIME SYSTEMS |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The vacuum bake/vapor
prime process provides a “one stop” environment for substrate
dehydration and vapor deposition of hexamethyldisilizane (HMDS). YES
systems give an HMDS prime layer with superior uniformity and stability.
The YES-3TA and YES-5TA models are our standard vacuum bake ovens. For
increased functionality, check out these enhanced models in the TA
Series:
to
YES-8TAE, 10TAE (Image Reversal)
to
YES-310TAE, 58TAE (Dual Function – Vapor Prime
+ Image Reversal) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
In wafer fabrication,
silane deposition is needed to promote the chemical adhesion of an
organic compound (photoresist) to a non-organic substrate (wafer). The
silane acts as a sort of “bridge,” with properties that will bond to
both the photoresist and wafer surface. Typically, hexamethyldisilizane
(HMDS) is used. Old wet processes for depositing silane generated a
substantial amount of hazardous waste. Additionally, the coating only
has a limited lifespan, meaning a process engineer has a small window of
time to apply photoresist before the bond degrades. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
BENEFITS |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
YES
Vacuum Bake System |
|
|
|
|
 |
Precise HMDS
application |
|
|
More time
available between process steps |
|
|
Less chemical
usage |
|
|
Stable process
results |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
INFORMATION |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
to
Product Specification Chart |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
to YES
Info Page |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SOFTWARE OPTIONS |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
to
Process
Management Software |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
TECHNICAL NOTES |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Priming Substrates prior
to Organic Coating
Technical Note 
Wafer Priming Batch vs.
Track
Technical Note |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
FEATURES |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The
YES Batch
Systems are designed on the premise that completely drying a semiconductor
wafer can take up to 20 minutes in a heated, evacuated chamber. Depending
on wafer size and the system selected, YES ovens will completely dehydrate
and prime up to 200-300 wafers each half hour operating cycle. 10mV electron shift in 200 Å Gate
Oxide. |
|
|
|
|
|
|
|
|
|
|
|
|
