YIELD Engineering Systems Inc.

The YES-CV200 plasma stripping systems remove thick layers of photoresist and polyimide in the shortest amount of production time. Powerful plasma stripping "sandblasts" tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected at the switch of a button.

Plasma cleaning technology replaces hazardous and messy wet chemical processes previously used to strip thick layers of photoresist and polyimide. Plasma stripping systems are effective for tough jobs as well gentler applications such as descumming and removing organics.

YES systems uses capacitive plasma generation with a relatively low plasma generation frequency, 40kHz. This reduces parasitic capacitive reactance losses for more efficient plasma generation. The result is reduced chamber and product heating that can be caused by high (13.56 MHz) frequency systems.

Plasma must pass through a grounded, perforated plate to reach substrates. This grounded plate serves to balance the charge in the plasma and shield your product from damaging UV exposure. For sensitive CMOS devices, low plasma charge paired with less UV exposure significantly reduces plasma damage that may induce a CV shift is essentially zero.

YES plasma strip/descum systems offer precise temperature control to achieve uniform, repeatable results.

YES plasma strip/descum systems come standard with four process gas connections. Mass flow controllers (MFCs) are available as an option for mixing gases.

Refinements of Plasma Processing Technical Note 
TF1 Wafer Testing Technical Note