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HYBRID
SEMI
SMT/PCB/PWB
ENERGY
SERVICES

 

 HYBRID

 SEMI

 SMT/PCB/PWB

 ENERGY

Manufacturing of Hybrid Circuits and Microelectronics

Semiconductor and MEMS manufacturing

Accessories, CAM and material for SMT and PCB/PWB

Process equipment for renewable energy, Solar Cells Fuel Cells

HYBRIDE GROUP 

DESCRIPTION 

ACCUPROBE
Probes, Probe Cards, Equipment and Technical Bulletins.

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100

Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding tools and SMT components.

ASM PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge Bonders

Flip-Chip Bonder

ASM is today the world’s number one assembly equipment manufacturer. We have focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders.

AUER
Products, Service

Film Frames, Flat Carriers, Magazines, Cassettes and Process Carriers.

AUREL
In-line, Automatic

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

DR. STORAGE
Products,  How to select/order,

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

GAISER
Products, Information

Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder Reflow Tools.

GLEN TECHNOLOGIES
News, Products

Plasma Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel Plasma Displays.

HYBOND
Ball Bonders,
Wedge Bonders, Peg Bonders

Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and Ribbon Bonding Machines.

JFP MICROTECHNIC
Products

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell

Near Infrared Furnace Systems for the Hybrid/Thick Film Applications, Wafer Bump and MCM/Flat Panel Production.

TPT TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder

The HB-Series of bench top size wire bonders are easy to operate and ideal for laboratories, pilot and pre-production. One Bond head for wire and ribbon bonding in Wedge or Ball bonding mode. 

UNITEMP
Sealer, RTP-100, RTP-150, VPO,
RSO-200, RSS-3X210, RSS-110-160-310
VSS, Hot Chuck, Hot Plate and
Accessories

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

UTHE
Generators, Transducers,
Negative EFO and Bond Monitor

Ultrasonic power supplies and transducers, bond monitoring systems, and other bonding equipment peripherals used in semiconductor assembly and testing.

WILLIAMS/MATERION
Vapor Deposition, Lids, Bonding Wire, Packaging Materials, Solder Alloys and Contact Alloys

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys.

HYBRID LINKS
IMAPS, IMAPS Nordic

Links to Hybrid web sites.

SEMI GROUP 

DESCRIPTION 

ACCUPROBE
Probes, Probe Cards, Equipment and Technical Bulletins.

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100

Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding tools and SMT components.

ASM PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge Bonders

Flip-Chip Bonder

ASM is today the world’s number one assembly equipment manufacturer. We have focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders.

AUER
Products, Service

Film Frames, Flat Carriers, Magazines, Cassettes and Process Carriers.

AUREL
In-line, Automatic

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

BMR TECHNOLGY CORP.
DFS-200 Downstream Plasma Asher, HiDep Plasma-Enchance CVD, HiEtch Inductive Coupled Plasma ICP

One of the industrial leader in the development of plasma-assisted equipment for thin film device fabrication.
BMR's advanced plasma technology provides the advanced solutions required for today's tough thin film materials in various industries
.

DR. STORAGE
Products,  How to select/order,

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

GAISER
Products, Information

Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder Reflow Tools.

GLEN TECHNOLOGIES
News, Products

Plasma Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel Plasma Displays.

HYBOND
Ball Bonders,
Wedge Bonders, Peg Bonders

Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and Ribbon Bonding Machines.

JFP MICROTECHNIC
Products

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell

Near Infrared Furnace Systems for the Semiconductor Applications, Wafer Bump and MCM/Flat Panel Production.

TPT TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder

The HB-Series of bench top size wire bonders are easy to operate and ideal for laboratories, pilot and pre-production. One Bond head for wire and ribbon bonding in Wedge or Ball bonding mode. 

UNITEMP
Sealer, RTP-100, RTP-150, VPO,
RSO-200, RSS-3X210, RSS-110-160-310
VSS, Hot Chuck, Hot Plate and
Accessories

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

UTHE
Generators, Transducers,
Negative EFO and Bond Monitor

Ultrasonic power supplies and transducers, bond monitoring systems, and other bonding equipment peripherals used in semiconductor assembly and testing.

WILLIAMS/MATERION
Vapor Deposition, Lids, Bonding Wire, Packaging Materials, Solder Alloys and Contact Alloys

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys.

YES
Products, Info

Polyimide Bake Ovens, Downstream Plasma Stripper, Vacuum Bake Vapor Prime Systems, Vacuum Dryers and Stainless Steel Cassettes for Wafer Processing.

SEMI Links
SEMI, Semitech, IMAPS

Links to SEMI web sites.

SMT/PCB/PWB GROUP 

DESCRIPTION 

ACCUPROBE
Probes, Probe Cards, Equipment and Technical Bulletins.

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

AEROFEED
NRC-300/RSC-100 and MTS-60

Storage Cabinets, for SMT components like reels, tubes and magazines of surface mount devices in an ambient environment.

AUREL
In-line, Automatic

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

EMC GLOBAL TECHNOLOGIES
Screen Cleaners, Solder Pallets
Process Carriers,
Workboard Holders

Stencil/Screen Cleaning Machines, Workboard Holders, Solder Pallets and Process Carriers.

DR. STORAGE
Products,  How to select/order,

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

FASTECHNOLOGIES
Machine Monitoring, SmartParts,
DNC UltraServer, BTR, FA/PLOT,
CassetteMaster, NC-CAM Drill,
NC-CAM Rout and
Information

CAM Systems for CNC optimization.

JFP MICROTECHNIC
Products

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell

Near Infrared Furnace Systems, for the PCB/PWB Production (like embedded passive resistors).

UNITEMP
Sealer, RPT-100, RPT-150, VPO,
RSO-200, RSS-3X210, RSS-110-160-310
VSS, Hot Chuck, Hot Plate and
Accessories

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

WILLIAMS/MATERION
Vapor Deposition, Lids, Bonding Wire, Packaging Materials, Solder Alloys and Contact Alloys

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys.

SMT/PCB/PWB Links
Nepcon, IPC

Links to SMT/PCB/PWB web sites.

ENERGY GROUP 

DESCRIPTION 

AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100

Nitrogen Storage Cabinets, for chip devices, waffle packs, solar cells, bonding tools and SMT components.

AUREL
In-line, Automatic

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

DR. STORAGE
Products,  How to select/order,

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

EMC GLOBAL TECHNOLOGIES
Screen Cleaners, Solder Pallets
Process Carriers,
Workboard Holders

Stencil/Screen Cleaning Machines, Workboard Holders, Solder Pallets and Process Carriers.

JFP MICROTECHNIC
Products

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell

Near Infrared Furnace Systems, for the Photovoltaic Applications.

UNITEMP
Sealer, RTP-100, RTP-150, VPO,
RSO-200, RSS-3X210, RSS-110-160-310
VSS, Hot Chuck, Hot Plate and
Accessories

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

WILLIAMS/MATERION
Vapor Deposition, Lids, Bonding Wire, Packaging Materials, Solder Alloys and Contact Alloys

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys.

ENERGY Links
EFN, EU PV, Photon

Links to Photovoltaic web sites.

SERVICES 

DESCRIPTION 

Probe Card

Accuprobe Inc.: Probe Card Assembly Service.

AUER
Services

Auer Precision: manufactures precision stampings for the commercial, industrial, aerospace, government, computer and semiconductor industries.

Corfin
Services

Corfin Inc.: Robotic tinning with trim and form, is available on a contract basis.

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Last modified: 2017-11-09