HOME ] UP ] FEEDBACK ] CONTENT ] SEARCH ]
HYBRID

[ HYBRID ] SEMI ] SMT/PCB/PWB ] ENERGY ] SERVICES ]
SITE LINKS
Accuprobe
Aerofeed
Aurel
Gaiser
Glen
Hybond
RTC
Stratus
Uthe
Vigitek
Williams
HYBRID Links

 

 HYBRID
Manufacturing of Hybrid Circuits and Microelectronics

 

HYBRIDE GROUP 

DESCRIPTION 

ACCUPROBE
Probes, Probe Cards, Equipment and Technical Bulletins.

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100

Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding tools and SMT components.

ASM PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge Bonders

Flip-Chip Bonder

ASM is today the world’s number one assembly equipment manufacturer. We have focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders.

AUER
Products, Service

Film Frames, Flat Carriers, Magazines, Cassettes and Process Carriers.

AUREL
In-line, Automatic

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

DR. STORAGE
Products,  How to select/order,

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

GAISER
Products, Information

Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder Reflow Tools.

GLEN TECHNOLOGIES
News, Products

Plasma Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel Plasma Displays.

HYBOND
Ball Bonders,
Wedge Bonders, Peg Bonders

Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and Ribbon Bonding Machines.

JFP MICROTECHNIC
Products

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell

Near Infrared Furnace Systems for the Hybrid/Thick Film Applications, Wafer Bump and MCM/Flat Panel Production.

TPT TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder

The HB-Series of bench top size wire bonders are easy to operate and ideal for laboratories, pilot and pre-production. One Bond head for wire and ribbon bonding in Wedge or Ball bonding mode. 

UNITEMP
Sealer, RTP-100, RTP-150, VPO,
RSO-200, RSS-3X210, RSS-110-160-210
VSS, Hot Chuck, Hot Plate and
Accessories

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

UTHE
Generators, Transducers,
Negative EFO and Bond Monitor

Ultrasonic power supplies and transducers, bond monitoring systems, and other bonding equipment peripherals used in semiconductor assembly and testing.

WILLIAMS/MATERION
Vapor Deposition, Lids, Bonding Wire, Packaging Materials, Solder Alloys and Contact Alloys

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys.

HYBRID LINKS
IMAPS, IMAPS Nordic

Links to Hybrid web sites.

HOME ] UP ] Accuprobe ] Aerofeed ] Aurel ] Gaiser ] Glen ] Hybond ] RTC ] Stratus ] Uthe ] Vigitek ] Williams ] HYBRID Links ]
Send mail to info@bita.lu with questions or comments about this web site.
Copyright © 1998 BITA ELECTRONIQUE S.A. 
Last modified: 2017-02-09