JFP Microtechnic 

JFP DB-1000/1100 FLIP-CHIP pick & place die Bonder
The Pick & Place DB-1000/1100 is designed for precise and accurate placement of delicate devices on substrate. It achieves a high accuracy placement of very small parts using a high magnification optical device, when required for very fine placement of small parts, as laser diodes. Flip option allows a perfect alignment of parts and substrate, mixing both video pictures. Eutectic control cycle protects substrate from oxidation: ramp-up to eutectic and back to idle using a fast cooling control of chuck. A robust, and reliable mechanical concept, designed to be external vibration free. Easy to use, flexible, the DB-1000 requires only minimum training to operate.

DB-1000/1100 Flip-Chip Pick & Place Die Bonder
(click on picture to enlarge)

Model Design: Table Top
Motorized Table: 3" (75 mm),
Die size: Minimum 250x250µm, Maximum 10x10mm
Substrate handled: Up to 200mm, Parts hold by vacuum or clamp, Substrate, Package
Table resolution: 1 µm
Joystick: 2 speeds + step mode
Alignment: Manual, with CCTV, Target generator, Dual video Mixing
Bond force: Programmable, Up to 250 gram
Bond Time: Programmable, up to 99 sec.
Vacuum: Selectable on or off during bond
Tool  rotation: 180°, Work height adjustable, Soft touch down speed
Vision : Colour CCD camera, Vertical viewing
Light: Direct and pen light
Display: Colour monitor; (Option for Flat monitor or Black and White)