JFP Microtechnic 

JFP SCRIBE S200-6
Scribe 200 machine is easy to use for singulating components on 6’’ wafer. Robust, the Scribe 200 unit is immediately operational, with a minimum training. Vertical targeting is carried out with a video set including a target generator (video crosshair). A LCD screen allows parameters display and selected through programming wheel. Micro-controller board, power supplies and electronic part are located into back side.

SCRIBE 200-6

JFP S100-3 SCRIBER
The Scribe 100 is a unique machine designed for low to medium production scribing and breaking of delicate die, such as gallium arsenide and silicon. It is user friendly, very flexible and uses a scribe and break sequence that keeps the finished die clean and free from damage. During the breaking mode, the Scribe 100 uses top mylar film to hold the die as the linear knife is raised to break along the core line. The film prevents contamination or stress to the die. All parameters are set from the control keyboard panel. The machine is robust, vibration free and requires minimal training to operate.

SCRIBE 100-3
(click on picture to enlarge)

Model Design: Table Top
Wafer size: Up to 3" (75 mm)
Wafer thickness: 100µm and up
Die size: Minimum 200µm
Wafer  ring: As standard, frame as option
Manual loading: Lockers
Die size: Minimum 500x500µm, Maximum 10x10mm
Table resolution: 1 µm
Joystick: 2 speeds + step or Jog mode
Alignment: Programmable area, manual
Scribe force: Dead weight, Stable, Very low force (3g/50g)
Scribe speed: Programmable, 0.1 to 2 mm/s
Scribe length: Programmable up to full length
Break Mode: Operator control
Breaking mode: Using Top Mylar and Bottom cutter
Mylar: Removable to avoid contamination
Vision: Color CCD camera
Digital zoom: For higher accuracy calibration 1 to 4x
Parameters: Scribe count, Work height, Scribe speed, Touch down speed, Repeat scribe
Material: GaAs, Silicon