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JFP MODEL PP5-2 |
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JFP
PP5-2 SEMI-AUTOMATIC
PICK & PLACE DIE BONDER
The Pick and Place PP5 is designed for the
precise placement of delicate devices on a substrate or package. The PP5
utilizes a robust and reliable mechanical concept, designed to be
extremely stable and vibration free. It is extremely user friendly,
requiring minimal training to operate. Light pick up head. Vertical color
camera, target generator and optical zoom. Moving the table XY by joystick
(Table resolution X,Y = 1µm). |
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FEATURES |
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PP5-2
Semi-Automatic Pick & Place
(click on picture to enlarge)
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The
version PP5-2 EPO
including
the basic system and a dispenser system. Display epoxy on screen.
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The
version PP5-2 EUT including the basic system, a temperature
controller with heated work holder. |
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System:
Microcontroller
Optical Zoom:
1 to 12x
Vision:
Color CCD, TFT monitor
Die size:
min 300x300, max 10 x10 mm
Substrate or package: up to 100 x100 mm
Accuracy: up to 25 µm
Motorized tables:
X 75mm (resolution 1 µm), Y 75mm (resolution 1µm), Manual Theta, speed
by joystick
Parameter:
LCD screen
Bond Force:
Programmable 15 g up to 500 g
Bond time:
Programmable 0 to 999 s
Scrub:
X&Y
Vacuum:
Selectable on or off during bond |
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OPTIONS |
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U.V
curing, |
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Eutectic,
digital control of ramp up and down, |
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Epoxy
by dispenser or stamping, |
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Hot
gas, |
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Heated
work-holder with gas control, |
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Customer
work-holder, |
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Large
Table, |
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Power:
110/230 VAC; < 500 watt
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Vacuum:
70% |
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Dimensions: 750x700x600mm (30"x28"x24") |
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Standards: Complies
with UL and CE standards |
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