|

| |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
JFP MODEL DB-5  |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
 |
 |
JFP
DB-5 ULTRASONIC
FLIP-CHIP die Bonder
The Pick & Place DB-5 is designed for accurate
placement of delicate devices on substrate. It achieves a high accuracy
placement using a high magnification optical device. Flip option allows a
perfect alignment of parts and substrate, mixing both video pictures. A
robust, and reliable mechanical concept, designed to be external vibration
free. Easy to use, flexible, the
DB-5 requires only minimum training to operate. |
 |

|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
STANDARD FEATURES |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |

DB-5
Flip-Chip Die Bonder
(click on picture to enlarge)
|
 |
 |
 |
 |
 |
High magnification optical device, |
 |
Flip Option allows a perfect alignment of part and substrate, mixing both
video images, |
 |
Horizontal or vertical ultrasonic transducer |
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Model Design:
Table Top
Motorized
Table: 2" (10mm),
10 degrees Die size: Minimum 500x500µm,
Maximum
10x10mm
Substrate handled:
Up to 100 mm,
Parts
hold by vacuum or clamp, Substrate, Package
Table resolution:
<2 µm
Joystick: 2 speeds,
adjustable
Alignment:
Manual, with CCTV,
Target
generator, Dual video Bond force:
Programmable,
Up
to 1000 gram Soft touch down speed Adjustable
Work-Holder height
Bond
Time: Programmable, up
to 99 sec.
Vacuum:
Selectable on or off during bond
Ultrasonic
generator: 20/40 w
Horizontal Transducer: 60 kHz
Vision
:
Colour CCD camera,
Vertical
viewing Light:
Direct and pen light
Display:
Colour monitor; (Option for Flat monitor or Black and
White) |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
   |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
OPTIONS |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Power:
110/230 VAC; < 500 watt
|
 |
 |
 |
 |
 |
Heavy duty bond head, (3 ranges);
Programmable, up to 3000
gram |
 |
Flip chip; Up-looking camera, Dual vision |
 |
Vertical Transducer Head available |
 |
Heated Work-Holder
|
 |
Binocular for inspection |
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Vacuum:
70% |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Forming
Gas: N2 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Air:
70 psi - 5 bar |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Dimensions: 750x700x600mm (30"x28"x24" ) |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Weight: Shipping; 45 kg (100 lb) |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Standards: Complies
with UL and CE standards |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|