HOME ] UP ] FEEDBACK ] CONTENT ] SEARCH ]
EXHIBITIONS

CONTACTS ] [ EXHIBITIONS ] NEWS ]
SITE LINKS
Productronica
SMT/HYBRID and Packaging
IPC-APEX
Semicon Europa

 

BITA  Exhibitions Page

Productronica 2017

Links to Contacts, Exhibitions and News (click on text)
EXHIBITION OVERVIEW 

The Productronica 2015 will take place in Munich, November 14- 17, 2017. Preliminary, the following of our suppliers will be present with machines, equipment etc.. 
NOTE: Ulf Berghman will be at the exhibition from
Tuesday late afternoon until Friday morning. You can contact him at: 0046 70 594 4230,

 PRODUCT    BOOTH AND CONTACT  
to ADT Products Pages

ADT
is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Hall B1
  Booth 142

Contact: Yossi Gershon (for Dicing Systems) and Ms. Miri Benita will help you with Dicing Blade questions.

ADT will not this year exhibiting any system.

 PRODUCT    BOOTH AND CONTACT  
MCM12 – Automatic Multi Chip Module Bonder

ASM
ASM Assembly Products will show their new Model MCM12 – Automatic Multi Chip Module Bonder. ASM is today the industry leader in Automatic Bonding and assembling equipment and systems.

Hall A3
  Booth 377

Contact: Patrick Van Asch will be at the booth for your assistance.

 PRODUCT    BOOTH AND CONTACT  
to AUREL Automation Products Page

AUREL
A
UREL Automation is specialized machines for material deposition and creation of precision-patterns. Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces for automatic production lines.

Hall A2
  Booth 481

Contact: Fabio Pagnotta
Screen printers , stand alone, in-line, for thick film, LTCC, green energies, sensors. Lasers for trimming, marking, cutting. Work Cell for ink-jet of nano materials, microdispensing, DOD, inspections.

 PRODUCT    BOOTH AND CONTACT  
to JFP Products Pages

JFP Microtechnic
Very new is the Model PP400 semiautomatic and PP400M manual Die Bonder, (however not shown at the exhibition, but could be discussed at the booth).

Hall B2
  Booth 356

Contact: François Palomares and Didier Magne,
JFP will show their Model PP5-6 Flip-Chip die bonder and PP-One, manual die placement.

 PRODUCT    BOOTH AND CONTACT  
to UniTemp Products Pages

UniTemp
Thermal Process ovens for laboratory and pre-production requirement. Hotplates/ workstages (workholders).

Hall B2
  Booth 356

Contact: Dr. Christopher Curran and Astrid Birkner
UniTemp will exhibit their new Model RSS-110-S/ RSS-160-S as well as the Model RSS-210-S Reflow Soldering Systems. A brand new Wire Bonder Model WB-200.

For more information contact:

 

HOME ] UP ] Productronica ] SMT/HYBRID and Packaging ] IPC-APEX ] Semicon Europa ]
Send mail to info@bita.lu with questions or comments about this web site.
Copyright © 1998 BITA ELECTRONIQUE S.A. 
Last modified: 2017-11-09