YIELD Engineering Systems Inc.

Yield Engineering Systems (YES) designs process control equipment used for precise surface modification and thin film coatings. Our equipment includes high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools. almost daily, YES equipment provides the control you need to handle chemicals today and in the future.

On March 31 1998 Glen Technologies was acquired by Yield Engineering Systems (YES).  Starting at the beginning of May ‘98, the plasma cleaning product range of both companies is combined and consolidated in the Glen Technologies facilities in Fremont, California (just a 10 minute drive from the YES facilities in San Jose, CA.).  Thus the Glen location is exclusively dedicated to the engineering, manufacturing, sales and support of plasma systems. No dilution with other technologies.

In semiconductor fabrication, YES equipment promotes photoresist adhesion to wafers using a process that requires 99% less chemical usage over wet processes.

In MEMS packaging, YES equipment provides a hydrophobic coating to reduce stiction, the undesired static friction that wears down devices.

For bioMEMS and biosensors (lab-on-a-chip), YES equipment applies a coating that fosters biocompatibility between synthetic material and natural tissues.

For microarray processing (DNA, protein, gene, tissue, and antibody), YES equipment promotes silane/substrate adhesion using a process that uses less chemicals and facilitates higher temperature boiling for the silanes.

For nanotech applications, YES equipment can accommodate a variety of functionally diverse silanes, for a variety of processes, on a variety of surfaces. With new chemical compounds being developed almost daily, YES equipment provides the control you need to handle chemicals today and in the future.

Below we've listed some typical applications for YES equipment. It’s pretty standard for customer requirements to drive our new product development. Meeting the needs of innovative process engineers is our passion, and our business model, for more than 25 years.

Priming Substrates prior to Organic Coating Technical Note 

Wafer Priming Batch vs. Track Technical Note 

Plasma & Plasma Cleaning Technical Note 

Note 110 - The use of Plasma for Surface modification Technical Note 

Note 115 - Chamber Design & Adhesion Strength Technical Note 

Note 125 - Electron-Free Plasma for ESD samples Technical Note 

Note 210 - Low vs. High Frequency Plasma Excitation Technical Note 

Image Reversal of Positive Photoresists Technical Note 

Optimize Image Reversal of Positive Photoresists Technical Note 

Image Reversal Techniques with Standard Positive Photoresist Technical Note 

Surface tension modification for Biotech Industry Technical Note 

Refinements of Plasma Processing Technical Note 

TF1 Wafer Testing Technical Note