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Organics Removal

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YIELD Engineering Systems Inc.

YES home page
ORGANIC REMOVAL 

YES-CV200RF

Oxygen plasma etching is an effective treatment for “burning off”, or bombarding, organic residues left on wafer surfaces due to resist cross-linking or polymerization. This method of removal is an environmentally friendly alternative to conventional solvent or acid processes.
Resist strippers, originally used to remove photoresist compounds, are also effective for removing organic contamination such a polymers.

Products such as the YES-CV200RF or YES-G Series are especially well suited for organics removal.
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Last modified: 2010-09-04