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UNITEMP GMBH.

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UTP-1100 UNIVERSAL THERMAL PROCESS OVEN 

This RTP/RTA System MODEL UTP-1100 allows a very fast heat treatment of a wafer up to 6”. This oven is a perfect tool for process development in the semiconductor and other industries. Some applications are: as a laboratory furnace for implementing of new processes, prototype research, quality control, environmental research, etc..

FEATURES  

UTP-1100 Rapid Terminal Process Oven
UTP-1100 Rapid Thermal Process Oven
bullet Fast "ramp up" rate: up to 75°C per second!
bullet Gas or vacuum atmosphere
bullet Loading area: up to 6" wafer
bullet Maximum temperature: 1000°C
bullet

Fast PID controller
bullet Excellent tool for various kind of processes
bullet Small place requirements
bullet

Ideal for R&D
DATA SHEET  
Get the UTP-1100 Datasheet in System MODEL UTP-1100.

RPT-1200 RAPID THERMAL PROCESS OVEN 

The Rapid Thermal Process Oven allows the heat treatment for a single Wafer up to 4” size. The RTP-1200 is an excellent tool for various semiconductor processes and other applications. Some applications are: as a laboratory furnace for all kind of developers, implementing and researching new semiconductor processes, prototype, research, quality control, environmental research purposes and for small pre-series or series production.

FEATURES  

RTP-1200 Rapid Terminal Process Oven
RTP-1200 Rapid Thermal Process Oven
bullet Table Top RTP System for up to  4” Wafer
bullet Temp.  max. 1200°C
bullet Ramp up rate: 150°C/second
bullet 20 programs saveable
bullet 100 steps programmable
bullet WIN based Software
bullet RS232 PC Software
bullet Vacuum
bullet Water cooled chamber
bullet Small space requirements (fits into 19” racks)
DATA SHEET  
Get the RTP-1200 Datasheet in System MODEL RTP-1200.

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Last modified: 2011-11-12