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|
UTHE BOND PROCESS ANALYZER |
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Uthe
support facilities are located in California, Japan, Singapore and
Malaysia. These support facilities are readily available to provide
technical assistance, full warranty and non-warranty services. |
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Uthe's Bond process Analyzer allows users to measure, quantify, and
store bonding impedance information. This analyzer captures real-time
impedance changes through out the bonding cycle and graphically displays
the information to an external computer. Data relating to effectiveness
of scheduled preventive maintenance can be developed and analyzed.
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OPTIONS |
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QIA module for frequency spectrum analysis
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Options for high power and high impedance loads
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SPECIFICATIONS |
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Sampling Rate: Selectable 100, 200, 400 microseconds
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Sampling Size: up to 16,455 wires |
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Transducer Frequency Measured: up to 60 kHz standard
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Ultrasonic Power Measured: up to 5 Watts
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Compatibility: most commercial wire bonders
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Requirements: Windows 3.X or higher, 8 MB RAM, 1 MB Hard disk
for program space |
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