 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
ABOUT TPT
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
TPT
TECHNICAL PRODUCT TRADE
Is a specialist supplier of bonding equipment for more then
10 years. The company has now developed a line of digital bonders for very precise
requirements. The company is located at Karlsfelt (outside Munich) in Germany. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PRODUCT OVERVIEW
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The line
of bonders is unique, since the bonding technology is interchangeable (Model
HB12, HB14 and/or HB16) with the H30 option (see datasheet). TPT designed
the bonders with motorized Z and Y-axis (not HB02-05 Series) and make use of
the latest digital technology. A number of features are already built-in
which normally are offered by other manufactures as an option. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
MANUAL BALL & WEDGE BONDER |
|
|
|
SEMI-AUTOMATIC WIRE BONDER |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
HB02, HB04 and HB05
Manual Wire Bonder
TPT
HB02, HB04 and HB05 Series of bench top size manual wire bonders are easy to operate for
laboratories, pilot and small-scale production.
One bondhead for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding
mode - no hardware change necessary (HB05). Direct access and simple adjustment to
all bond parameters. |
|
|
|
 |
|
|
|
HB06, HB08 and HB10
Semi-Automatic_Wire_Bonder
TPT
HB06, HB08 and HB10 Series of bench top size semi-automatic wire bonders with motorized
Z-axis. One bondhead for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding
mode - no hardware change necessary (HB10). Direct access and simple
adjustment to all bond parameters. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SEMI-AUTOMATIC WIRE BONDER |
|
|
|
HB16D
WIRE BONDER WITH DIE BONDING |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
HB12, HB14 and HB16
Semi-Automatic_Wire_Bonder
TPT
HB12, HB14 and HB16 Series of bench top size semi-automatic wire bonders with both
motorized table and Z-axis (bond head), provides the best performer for pilot pre-production
runs and small-scale production lines. |
|
|
|
 |
|
|
|
H80
the "Pick and Place" Bonding option for HB16
The H80 option is making the HB16 to act as well as a
"Pick and Place/Die Bonder. The option is designed for easy change from wire
bonding to die bonding. The system is equipped with fine ratio manipulator.
Programmable force and time. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SEMI-AUTOMATIC WIRE BONDER |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
HB30 Heavy Wire Bonder
The TPT HB30 is a bench top size heavy wire bonder.
Excellent for laboratories, pilot and pre- production, Easy operation
with TFT (Touch Panel Operator System). Direct access and simple adjustment
to all bond parameters and programs |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
