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TPT HB16

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TPT Franz Hickmann

TPT
TPT SEMI-AUTOMATIC BONDERS  WITH MOTORIZED Z-AXIS and Y-AXIS (table) 

Model HB12, HB14 and HB16 Series of bench top size semi-automatic wire bonders with TFT touch panel and motorized Z and Y-Axis control are easy to operate pilot pre-production runs and small-scale production lines. One Bondhead (HB16) for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode. No hardware change necessary (HB16). Direct access and simple adjustment to all bond parameters.

STANDARD FEATURES 


  HB12, HB14 and HB16 Series Semi-Automatic Wire Bonders

 HB16D is combined Semi-Automatic Wire/Pick & Place Bonder
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90° Bonding Deep-Access Bond Head
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6.5" TFT Touch Panel Operation System
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PPL Ultrasonic Generator
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High/Low Ultrasonic Selection (1 or 2 watt)
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Large Bonding Area
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Stitch and Bump Bonding
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99 Program Storage Capability
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FDD 3.5" to store bonding programs
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Built-in Dual Fiber Optics Illuminator
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Built-in Heater Controller for Workholder
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Bond Arm Length 165 mm
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Motorized 2" Wire Spool
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Electronic Flame-Off and ball size control (for Ball Bonding)
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Semi-Automatic, Step and Manual Bonding Mode
OPTIONS 
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H10 Zoom Stereo-Microscope Leica S6-20x

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H20 Built in Heater Stage Controller (up to 250°C)
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H12 Zoom Stereo-Microscope Leica MZ6 16x
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H21 100x100 mm square Adjustable Height Heated Workholder
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H26 60 mm round Adjustable Height Heated Workholder
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H29 90 mm round Adjustable Height Heated Workholder
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H43 Tool heater and Temperature Controller with LCD Display
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H50 Spotlight Targeting System
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H72 Wire Spool Adapter for 0.5" spool
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H73 Torque Wrench 25 cNm for exact tighten of bonding tool
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H90 Delivery with installation and user training
INFORMATION  
HB12 Wedge Bonder Data Sheet TPT HB12 Semi-Automatic Wedge Bonder
HB14 Ball/Bump Bonder Data Sheet TPT HB14 Semi-Automatic Ball/Bump Bonder
HB16 Wedge/Ball/Bump Bonder Data Sheet TPT HB16 Semi-Automatic Wedge/Ball/Bump Bonder
H80 The "Pick & Place/Die option  Data Sheet TPT HB16 Semi-Automatic Wedge/Ball/Bump Bonder

to TPT info page
WIRE/RIBBON CAPABILITY: BONDHEAD:
for Al wedge bonding 17µm to 75µm wire Deep-access (12mm)
for Au wedge bonding 17µm to 75µm wire CONTROL OF 1ST AND 2ND BONDPARAMETERS:
for Au ribbon bonding max. 25µm x 250µm Independent
for Au ball bonding 17µm to 50µm wire BONDING OPERATION PROCESS:
for Au bump bonding 17µm to 50µm wire Motorized Z axis (Bond Head) with table tear
 SPECIFICATION    HARDWARE 

Motorized Axis

Z-Azis (15mm) and Y-Axis (7mm)

Ultrasonic System

PLL control 62 kHz transducer

Wire Feed Angle

90° deep-access

Bondarm Length

165 mm

Control Panel

6.5 inch TFT Touch Panel

Loopheight and Profile

Programmable Loopheight and Profile

Storage capacity

100

Wire Termination

Bondhead and Table Tear

Wirespool handling

2 inch motorized

Fine Table Motion

10x10 mm

Mouse Ratio

6:1 ratio (optional 4:1 or 3:1)

Ultrasonic Power

0- 2 W output

Bond Time

15- 5'000 msec.

Bondforce

15- 100 cN

Heater Stage Controller

Built-in, 250° C max.

Lighting

Built-in Dual Fiber Optic Illuminator

Electrical Requirements

100- 240 V ± 10%, 50/60 Hz, 10 A  max.

Physical Dimensions

700 mm W x 650 mm D x 500 mm H

Weight

net 42 Kg

Industry Standards

CE certified
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Copyright © 1998 BITA ELECTRONIQUE S.A.
Last modified: 2010-09-04