RADIANT TECHNOLOGY CORP.

Users of SMD solder reflow systems insist on stringent control of the process.  They understand that tight control of all process parameters is essential if first time yields are to be maximized. Radiant Technology Corporation understands the meaning of true process control.  Every aspect of control in our reflow systems is precise from closed-loop PID control of zone temperatures to closed-loop control of conveyor speed. The most critical process parameter in solder reflow is the heating rate.  The lower the heating rate, the more forgiving the process.  Sometimes, however, high heating rates must be employed. Our furnaces provide the process engineer with better control flexibility in terms of the process window and, therefore, can operate over a wider dynamic range without risk of component or product damage. 

RTC furnaces provide exceptional forced air environmental control.  Internal positive pressure, baffle gates, and air curtains prevents the over all process from being influenced by outside disturbances. RTC systems are equipped for compressed air or nitrogen use. Compressed air is sufficient for most solder reflow processes and is most commonly used for its lower operating cost. 

RTC Model SMD-924
(click on picture to enlarge)