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RTC EFC-SERIES REFLOW
SOLDER SYSTEMS |
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The Enhanced Forced
Convection reflow soldering system is designed for today's SMD
manufacturing environment which demands, high yields in high volume
production, low operating and maintenance costs, simplified operation with
less operator attention, and greater flexibility with fewer required
profiles. With the experience gained from installing thousands of precision
heating units World Wide, RTC understands the need for a rugged, trouble
free design. And the EFC Series reflow soldering system is true to RTC
standards. |
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BENEFITS AND FEATURES |
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EFFICIENT HEAT TRANSFER |
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Through the highest combination of velocity and re-circulating volume in
the industry. |
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SELF-CLEANING |
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"flux burn off" operation in both the
heating and the rapid cooling zones. |
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BETTER
ZONE DEFINITION |
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with transverse side to side re-circulation. |
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RAPID
SYSTEM HEAT UP AND COOL DOWN |
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with patented chamber
design featuring fast response quartz heaters.
Room ambient to operating temperature and stabilization in 10
minutes. Reflow profile down to adhesive cure profile in 12 minutes. |
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EASY
AND QUICK ACCESS |
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to process area, electronics, heating elements,
thermocouples, and gas flow accelerators.
Any single component of the system can be removed without any
disassembly of the heating section within five minutes. |
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INERT
ATMOSPHERE
(< 20 ppm Oxygen), |
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throughout the heating and
rapid cool sections. Low Process Gas Consumption |
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OPTIONS |
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RTC Model EFC-1215
(click on picture to enlarge) |
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Air Purification System. |
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Conveyor extension. |
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Oxygen analyzer. |
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Uninterruptible Power Supply. |
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Element Monitor. |
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Conveyor Extensions. |
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Custom painting. |
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On-screen profiling. |
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Light tower. |
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PRODUCT DATA SHEETS
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 RTC EFC-Series
Overview  |
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SPECIFICATIONS
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