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HYBRID GROUP |
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DESCRIPTION |
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ACCUPROBE
Probes,
Probe Cards,
Equipment
and Technical Bulletins. |
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High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
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AEROFEED
Vari-Cab, WPS, and
NRC-300/RSC-100 |
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Nitrogen
Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding
tools and SMT components. |
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ASM
PACIFIC TECHNOLOGY
Wafer
Bump, Die Bonders,
Ball Bonders,
Wedge Bonders
Flip-Chip Bonder, |
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ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
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AUER
Products, Service |
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Film
Frames, Flat Carriers, Magazines, Cassettes and Process Carriers. |
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AUREL
In-line,
Automatic |
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AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
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C+L
DEVELOPMENT |
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Handling Systems for Magazines, Cassettes and Process Carriers. |
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GAISER
Products,
Information |
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Capillaries,
Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap
Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
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GLEN
TECHNOLOGIES
News, Products |
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Plasma
Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel
Plasma Displays. |
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HYBOND
Ball Bonders,
Wedge Bonders,
Peg Bonders |
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Manual and semi-automatic
PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
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JFP
MICROTECHNIC
Products |
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Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
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RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
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Near Infrared Furnace Systems for the Hybrid/Thick Film
Applications, Wafer Bump and MCM/Flat Panel Production. |
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TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
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The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
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UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
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Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests. |
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UTHE
Generators, Transducers,
Negative EFO and Bond Monitor |
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Ultrasonic power supplies and transducers, bond monitoring
systems, and other bonding equipment peripherals used in semiconductor assembly and
testing. |
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WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
|
|
|
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys. |
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HYBRID LINKS
IMAPS,
IMAPS Nordic |
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Links to Hybrid web sites. |
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SEMI GROUP |
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DESCRIPTION |
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|
|
|
|
|
|
|
ACCUPROBE
Probes,
Probe Cards,
Equipment
and Technical Bulletins. |
|
|
|
High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AEROFEED
Vari-Cab, WPS, and
NRC-300/RSC-100 |
|
|
|
Nitrogen
Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding
tools and SMT components. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ASM
PACIFIC TECHNOLOGY
Wafer
Bump, Die Bonders,
Ball Bonders,
Wedge Bonders
Flip-Chip Bonder, |
|
|
|
ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AUER
Products, Service |
|
|
|
Film
Frames, Flat Carriers, Magazines, Cassettes and Process Carriers. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AUREL
In-line,
Automatic |
|
|
|
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
|
|
|
|
|
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BMR
TECHNOLGY CORP.
DFS-200 Downstream
Plasma Asher, HiDep
Plasma-Enchance CVD,
HiEtch Inductive Coupled Plasma
ICP, |
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One of
the industrial leader in the development of plasma-assisted equipment for
thin film device fabrication.
BMR's advanced plasma technology provides the advanced solutions required
for today's tough thin film materials in various industries. |
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C+L
DEVELOPMENT |
|
|
|
Handling
Systems for Magazines, Cassettes and Process Carriers. |
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
GAISER
Products,
Information |
|
|
|
Capillaries,
Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap
Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
GLEN
TECHNOLOGIES
News, Products |
|
|
|
Plasma
Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel
Plasma Displays. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
HYBOND
Ball Bonders,
Wedge Bonders,
Peg Bonders |
|
|
|
Manual and semi-automatic
PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
JFP
MICROTECHNIC
Products |
|
|
|
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
|
|
|
Near Infrared Furnace Systems for the Semiconductor
Applications, Wafer Bump and MCM/Flat Panel Production. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
|
|
|
The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
|
|
|
Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
UTHE
Generators, Transducers,
Negative EFO and Bond Monitor |
|
|
|
Ultrasonic power supplies and transducers, bond monitoring
systems, and other bonding equipment peripherals used in semiconductor assembly and
testing. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
|
|
|
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys. |
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
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|
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|
Y.E.S.
Products,
Info |
|
|
|
Polyimide Bake Ovens, Downstream Plasma Stripper, Vacuum Bake Vapor
Prime Systems, Vacuum Dryers and Stainless Steel Cassettes for Wafer Processing. |
|
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|
SEMI
Links
SEMI, Semitech, IMAPS |
|
|
|
Links to
SEMI web sites. |
|
|
|
|
|
|
|
|
|
|
|
|
SMT/PCB/PWB GROUP |
|
|
|
DESCRIPTION |
|
|
|
|
|
|
|
|
|
|
|
|
|
ACCUPROBE
Probes,
Probe Cards,
Equipment
and Technical Bulletins. |
|
|
|
High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AEROFEED
NRC-300/RSC-100 and
MTS-60 |
|
|
|
Storage Cabinets, for SMT components
like reels, tubes
and magazines of surface mount devices in an ambient environment. |
|
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|
|
|
|
|
|
|
|
|
|
|
|
AUREL
In-line,
Automatic |
|
|
|
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EMC GLOBAL
TECHNOLOGIES
Screen Cleaners,
Solder
Pallets
Process Carriers,
Workboard Holders |
|
|
|
Stencil/Screen Cleaning Machines, Workboard Holders, Solder
Pallets and Process Carriers. |
|
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|
|
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FASTECHNOLOGIES
Machine Monitoring,
SmartParts,
DNC UltraServer,
BTR,
FA/PLOT,
CassetteMaster,
NC-CAM Drill,
NC-CAM Rout
and
Information |
|
|
|
CAM Systems for CNC optimization. |
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|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
JFP
MICROTECHNIC
Products |
|
|
|
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
|
|
|
Near Infrared Furnace Systems, for the
PCB/PWB Production (like
embedded passive resistors). |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
|
|
|
Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
|
|
|
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SMT/PCB/PWB
Links
Nepcon, IPC |
|
|
|
Links to SMT/PCB/PWB web sites. |
|
|
|
|
ENERGY GROUP |
|
|
|
DESCRIPTION |
|
|
|
|
|
|
|
|
|
|
|
|
|
AEROFEED
Vari-Cab, WPS, and
NRC-300/RSC-100 |
|
|
|
Nitrogen
Storage Cabinets, for chip devices, waffle packs, solar cells, bonding
tools and SMT components. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
AUREL
In-line,
Automatic |
|
|
|
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EMC GLOBAL
TECHNOLOGIES
Screen Cleaners,
Solder
Pallets
Process Carriers,
Workboard Holders |
|
|
|
Stencil/Screen Cleaning Machines, Workboard Holders, Solder
Pallets and Process Carriers. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
JFP
MICROTECHNIC
Products |
|
|
|
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
|
|
|
Near Infrared Furnace Systems, for the
Photovoltaic Applications. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
|
|
|
Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
|
|
|
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys. |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ENERGY
Links
EFN,
EU PV,
Photon |
|
|
|
Links to Photovoltaic web sites. |
|
|
|
|
|
|
|
|
|
|
