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HYBRID GROUP |
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DESCRIPTION |
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ACCUPROBE
Probes,
Probe Cards,
Equipment
and Technical Bulletins. |
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High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
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AEROFEED
Vari-Cab, WPS, and
NRC-300/RSC-100 |
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Nitrogen
Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding
tools and SMT components. |
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ASM
PACIFIC TECHNOLOGY
Wafer
Bump, Die Bonders,
Ball Bonders,
Wedge Bonders
Flip-Chip Bonder, |
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ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
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AUER
Products, Service |
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Film
Frames, Flat Carriers, Magazines, Cassettes and Process Carriers. |
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AUREL
In-line,
Automatic |
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AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
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C+L
DEVELOPMENT |
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Handling Systems for Magazines, Cassettes and Process Carriers. |
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GAISER
Products,
Information |
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Capillaries,
Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap
Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
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GLEN
TECHNOLOGIES
News, Products |
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Plasma
Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Biotech and Flat Panel
Plasma Displays. |
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HYBOND
Ball Bonders,
Wedge Bonders,
Peg Bonders |
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Manual and semi-automatic
PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
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JFP
MICROTECHNIC
Products |
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Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
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RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
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Near Infrared Furnace Systems for the Hybrid/Thick Film
Applications, Wafer Bump and MCM/Flat Panel Production. |
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TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB06-12 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
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The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
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UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
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Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests. |
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UTHE
Generators, Transducers,
Negative EFO and Bond Monitor |
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Ultrasonic power supplies and transducers, bond monitoring
systems, and other bonding equipment peripherals used in semiconductor assembly and
testing. |
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WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
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Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys. |
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HYBRID LINKS
IMAPS,
IMAPS Nordic |
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Links to Hybrid web sites. |
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