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MAXIBOND WEDGE DESIGN  

Gaiser Tool Company has recently obtained patent pending status for a new, next-generation small wire wedge design for gold and aluminum wire. This new design should replace the venerable maxiguide in many applications.
To understand the features and benefits of the new MaxiBond design, it is necessary to understand the two types of small wire wedge designs currently available.
The first and earliest design, the V-Notch, was introduced sometime in the early 1960’s.  The V-notch design incorporates the front radius (FR), bond length (BL), and back radius (BR) features we are accustomed to today, with an open notch design through which the wire must travel after it exits the wire feed hole.
The second design, and current standard-bearer in wedge performance, is the Maxiguide.  This circa 1979 design was a Gaiser Tool Co. innovation, invented by Dennis Gaiser.  The Maxiguide, also called pocket-type, features a pocket with side-walls that contains and guides the wire after the feed hole, and centers the wire under the bond foot geometry (the FR, BL, & BR).
The Maxiguide has proven to provide the best wire centering under the bond foot and placement accuracy on the bonding pad of any small wedge design. But today we have the new MaxiBond wedge, download the  MaxiBond brochure for complete information: MaxiBond_Brochure

NEW WAFER SCRIBER FROM JFP MICROTECHNIC 

Scribe 200 machine is easy to use for singulating components on 6’’ wafer. Robust, the Scribe 200 unit is immediately operational, with a minimum training. Vertical targeting is carried out with a video set including a target generator (video crosshair). A LCD screen allows parameters display and selected through programming wheel. Micro-controller board, power supplies and electronic part are located into back side.

GAISER TOOL COMPANY
As a leading manufacturer of bonding tools since 1967, Gaiser Tool Company has significantly contributed to the technology required for the growth of the semiconductor industry. In 1970, Gaiser Tool Company revolutionized the wire bonding process by inventing the first alumina ceramic capillary. In 1997, Gaiser Tool Company developed a superior and proprietary new process for manufacturing capillaries for ultra fine pitch bonding, Process1800. This new process enables Gaiser Tool Company to produce bottleneck style capillaries that are up to two times stronger than the bottleneck capillaries produced by our competitors. This product leads the way in meeting the fine pitch needs of the semiconductor industry.
Gaiser Tool Company’s long-term commitment to their customers will always include both the quality of their products and the quality of their service.

JFP MICROTECHNIC
The company have been acting in the microelectronic industry for more then 15 years. The key personal have 25 years of experience and as a result of market demand developed a line of manual machines for unique applications.  

MaxiBond_Small_Wire_Wedge
This patent pending design combines the desirable characteristics of both the V-Notch and the Maxiguide style wedges without the inherent disadvantages of either. 
The MaxiBond small wire wedge represents the first truly new wedge tip geometry in decades. 

JSP S200-6 Scriber
The Scribe S200-6 and S100-3 are unique machines designed for low to medium production scribing and breaking of delicate die, such as gallium arsenide and silicon. It is user friendly, very flexible and uses a scribe and break sequence that keeps the finished die clean and free from damage.