JFP Microtechnic 

JFP MICROTECHNIC
The company have been acting in the microelectronic industry for more then 15 years. The key personal have 25 years of experience and as a result of market demand developed a line of manual machines for unique applications.

The line of die bonders/scribe unit is unmatched, as a result of a ridged design and performance. The machines have been engineered for maximal accuracy and handling of  very small parts. 

DB-5 FLIP CHIP DIE BONDER  

DB-1000 FLIP CHIP P&P DIE BONDER 

DB-5 
The Pick & Place DB-5 Flip-Chip Die Bonder is engineered for ultrasonic and heavier bonding designed for accurate placement of delicate devices on substrate. Flip option allows a perfect alignment of parts and substrate, mixing both video pictures.

DB-1000/1100  
The Flip-Chip, Pick & Place DB-1000/ 1100 Die Bonder is designed for precise and accurate placement of delicate devices on substrate. It achieves a high accuracy placement of very small parts using an high magnification optical device, when required for very fine placement of small parts, as laser diodes.

SCRIBE S100-3  

PP5-2 SEMI-AUTO P&P DIE BONDER 

SCRIBE S200-6 and S100-3 
The Scribe S200-6 and S100-3 are unique machines designed for low to medium production scribing and breaking of delicate die, such as gallium arsenide and silicon. It is user friendly, very flexible and uses a scribe and break sequence that keeps the finished die clean and free from damage.

PP5-2  
The PP5-2 is a Semi-Automatic Pick & Place Die Bonder designed for the precise placement of delicate devices on a substrate or package. The PP5-2 utilizes a robust and reliable mechanical concept, designed to be extremely stable and vibration free.