HYBOND INC.

Hybond Inc.
Manufactures equipment specifically designed for assembly of electronic products. Their current customers include manufacturers of microwave, semiconductor, and hybrid components as well as hard disks, coils and miniaturized transformers.      

Hybond offers wire bonders, die attach machines, work stages, bonders for insulated wire, dynamic force measurement equipment and specialized equipment for unique assembly requirements. Their line of equipment includes both manual and semiautomatic capabilities and is oriented toward those companies whose applications do not require high speed, high cost automatic equipment. They pride themselves on flexibility and customer service and will respond to new and unique application or requirements for equipment that they do not yet manufacture. Hybond is prepared to answer any questions that our customers or prospective customers may have regarding their products. 

Model 522A and 522A-40 Bonders,
Hybond Manual Ball Bonders, sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, bond time, ultrasonic energy, tail length, EFO.

Model 572/572A-40 and 676,
Two wedge bonder designs available, digital and analogue
Model 626 Multipurpose
Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder.

Model 616-Series Peg Bonders,
Model 616-Series performs ultrasonic attachment of insulated or un-insulated wire/ribbon. It also is used for ball coining, ribbon-tacking, pin-tab bonding, and mesh bonding.