HYBOND INC.

HYBOND sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, bond time, ultrasonic energy, tail length, EFO power, and stage heat. The 4:1 X-Y manipulator stage movement and Z axis bond motion are conveniently located to reduce operator fatigue. Precision machined mechanical components with sealed ball bearings at major points are durable and trouble free. Modular electronics facilitate quick and cost effective maintenance.

Imitated but never duplicated, HYBOND's exclusive Soft Touch™ force ramping system bonds effectively with less trauma to sensitive materials like GaAs and InP.

Superior wire control is provided by the motorized feed system which features clamps capable of feeding wire and ribbon, dial adjustable tail length, switch for manual tail length adjustment and clamp pull back dial adjustment to allow bonding and cutting of softer (higher elongation) wires than conventionally used for wedge bonding. Model 572A includes front panel independent controls for 1st and 2nd bond U/S, Time & Force as well as for the built in workstage temperature controller. The 572A has a proven track record of safe and effective wire and ribbon bonding worldwide.

Model 572A

Model 572A-40 "long-reach"

Model 626 is a Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. Model 626 can be used for wire diameters from 0.7 to 2.0 mil (18 to 51µm) gold wire when in ball bonder configuration or 0.5 to 3.0 mil (12 to 76µm) and ribbon up to 1.0 x 12.0 mil (25 x 300µm) when in wedge or Peg bonding mode.

The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's and LED's. Model 626's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and allow the operator to increase or decrease tail length in 1 mil (25µm) increments at a touch of a switch. Model 626 shows actual units for set up of bond parameters.

Change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. Model 626 can also operate in Bump or Peg bonding modes. Add option "OP-47" for pick, place and bond feature.

Model 626 "Multipurpose" Wedge/Peg or Ribbon Bonder

Model 676 is a Deep Access, Long Reach Thermosonic Wedge Bonder for wire diameters from 0.5 to 3.0 mil (12 to 76µm) and ribbon up to 1.0 x 12.0 mil (25 x 300µm) featuring HYBOND's unique Soft Touch™ energy system. Model 676 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and bonding wires to sensitive devices such as gallium arsenide FET's and LED's. Model 676's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and also allow the operator to increase or decrease tail length in 1 mil (25µm) increments at a touch of a switch. The amount of clamp "pull-back" required to break the wire at final bond may also be varied in relation to wire elasticity allowing the use of softer wires (higher elongation) than conventionally used in wedge bonding. Model 676 shows actual units for set up of bond parameters.

Model 676 Digital Wedge/Ribbon Bonder