HYBOND INC.

Model 616-005 (performs ultrasonic attachment of insulated or uninsulated wire/ribbon), ball coining, flex-on-flex, ribbon-tacking, pin-tab bonding, and mesh bonding. Unlike Model 616-001, this unit contains a built-in temperature controller.

Model 616-001 (performs ultrasonic attachment of insulated or uninsulated wire/ribbon). It also is used for ball coining, ribbon-tacking, pin-tab bonding, and mesh bonding.

Model 616-003 (performs ultrasonic attachment of insulated or uninsulated wire/ribbon). This unit is designed as a direct replacement for reflow soldering equipment.

Model 616A-003 (performs ultrasonic attachment of insulated or uninsulated wire/ribbon), ball coining, flex-on-flex, ribbon-tacking, pin-tab bonding, and mesh bonding. This bonder uses a servo motor to control bond head movement and features digital displays of bond parameters in their actual units. It features non-volatile storage of up to 10 bond schedules.

Hybond's Model 616-005 ultrasonic single channel peg bonder has been designed to perform ultrasonic attachment of insulated or bare wire / ribbon. Unlike the 616-001, this unit contains a built-in in temperature controller. Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.

Model 616-005

Hybond’s Model 616-001 ultrasonic single channel PEG Bonder has been designed to perform ultrasonic attachment of insulated or bare/ribbon. Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding and mesh bonding.  

Model 616-001

Hybond’s Model 616-003 ultrasonic single channel PEG Bonder has been specially designed to replace the weld head and power supply on reflow solder stations. This allows the use of pre-existing programmable X-Y staging and the conversion of these parts to ultrasonic bonding capability. Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding and mesh bonding. 

Model 616-003

Hybond’s Model 616A-003 ultrasonic single channel PEG Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire. Applications include “tacking” tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding and ball coining. When fitted with WP-280 and OP-75 options, the 616A-003 becomes a semiautomatic machine for medium to high volume production.

Model 616A-003