|

|

|
The 1573 series
is
typically specified for fine-pitch bonding applications where an angle bottleneck is not
yet required. The small "T" and small "B" design work well with
closely spaced, small bond pads, and the radiused inside chamfer "IR" provides
excellent
|

|

|
 |
 
|
looping and wire control for use in high-speed
automated bonders. The 1573 series is most commonly specified with the optional 20° cone
angle, but is available in standard 30°, and optional 20° and 15°.
|

|

|