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GAISER TOOL COMPANY

Gaiser Tool Company - Home Page

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GAISER CAPILLARY INFORMATION

1. WIRE BONDING CAPILLARIES - GENERAL INFORMATION  

Wire bonding of gold wire in microelectronic devices is the oldest and most commonly used method in interconnecting technology. The ceramic capillary is the tool most frequently used to make these interconnections.
The ceramic capillary has undergone many changes as its usage has progressed from the manufacturing of 16 lead plastic packages to the more recent challenge of 304 lead plastic packages.
Following are the basic requirements for successful wire bonding: 

bullet Clean metallization
bullet Proper temperature
bullet Sufficient force
bullet Power
bullet Ultrasonic tuning
bullet Clamped work piece
bullet Proper capillary in functional condition

Factors such as bond pad size, bond pad pitch, wire diameter and hardness, metallization, bonder speed and accuracy, loop height, loop length, and package layout will affect the capillary chosen for a wire bonding application. Proper capillary selection is essential for successful wire bonding. Gaiser Tool Co. offers a variety of capillary designs to meet the requirements of various wire bonding applications.  

Get the BASIC CAPILLARY BONDING and DESIGN document in BASIC CAPILLARY BONDING/ DESIGN format

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[ HOME ] [ UP ] [ Cap. Design ] [ Tip Diameter ] [ Face Angle ] [ OR Dimensions ] [ Tip Finish ] [ Hole Diam. ] [ Core Angle ] [ ICA 1 ] [ ICA 2 ] [ CD ] [ Fine Pitch 1 ] [ Fine Pitch 2 ] [ Problem ] [ Order 1 ] [ Order 2 ] [ Tip Mod. ] [ Side Reliefs ] [ Important 1 ] [ Important 2 ]
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Last modified: 2010-09-04