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Hole Diam.

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GAISER TOOL COMPANY

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GAISER CAPILLARY INFORMATION

7. HOLE DIAMETER

GTC Figure 16

Figure 16. The hole diameter (H) is typically 0.0005in. /13µm to 0.0008in. /20µm larger than the wire diameter.
 

GTC Figure 17

Figure 17. A larger H dimension assists with the flow of wire on high speed bonders. However, a small H dimension may be required to produce small ball bonds and for more precise bond placement

 

GTC Figure 18

Figure 18. There can be many causes for wavy or sagging wires. Some of them are:

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Excessive wire drag due to a hole diameter being too small
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Excessive wire drag due to the inside chamfer being too small or damaged
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Use of high elongation (soft) wire
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Use of too small of wire diameter for the loop length desired

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Last modified: 2011-11-12