Figure 2. Besides two
capillaries, one with a tip diameter (T dimension) of 0.0090in./229µm; the other T
dimension is 0.0065in./165µm. The larger T dimension provides a longer bond length for a
successful second bond; however the larger T dimensions limits access into
fine-pitch applications.
Figure 3.
Picture to the
right shows an example of a weak/chopped-off second bond. The primary reasons for
weak/chopped-off bonds are:
Capillary T
dimension is too small
Worn inside
chamfer which shortens bond length of capillary
Figure 4.
The stitch bond on
the left is made with a capillary having the T=0.0059in./150µm. The middle stitch bond is
made with a T=0.0065in./165µm. The stitch bond on the right is made with a T=0.009in./229µm.
A larger T dimension provides a longer bond length and therefore a larger surface area for
a superior intermetallic weld.
Figure 5. A tool with the
same capillary tip may provide stitch bonds with different widths. A stitch bond made in
the East-to-West direction will be wider than a stitch bond made in the North-South
direction. This is due to the ultrasonic motion of the capillary scrubbing across the
wire. A stitch bond made in the North-to-South direction will be because the ultrasonic
motion scrubs in-line with the wire.
Many of the newer wire-bonding machines are capable of counteracting some of the effect of
the direction of the ultrasonic's by stage motion and other techniques. The
goal of these innovations is to minimize the difference in stitch-bond
strengths. To date, the scrub direction issue has not been completely
resolved.
Figure 6. There are several reasons for second
bond nonsticking. Some of these are:
Poor plating or
metallization
Contamination
Lead or package not clamped
rigidly, allowing the lead to move during scrubbing
Lead surface not planar to the
capillary's face
Improper power, force or time
settings
Small T dimension
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