|

|

|
The 1593 series
capillary is equipped with an angle bottleneck for loop clearance in fine pitch bonding
applications. The 90° radiused inside chamfer works well in high-speed automated
bonders,
providing excellent looping characteristics and wire control.
|

|

|
 |
 
|
The
90° inside chamfer forms a
compact ball bond and provides excellent 2nd bond tailing. The 4° face angle provides
increased downward force on the 2nd bond to enhance weld attachment in
situations of poor bondability.
|

|

|