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The 1590 series
capillary is equipped with an angle bottleneck for loop clearance in fine pitch bonding
applications. The radiused inside chamfer "IR" design is ideal for
high-speed automated bonders, providing the finest looping characteristics
and wire
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control available in the industry. The 8° face angle provides
good 2nd bond tailing and allows ample 2nd bond cross-sectional area for reduced heel
cracking. The 8° face angle is ideal for modern high-speed automated wire bonders on a
variety of bonding.
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