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YES-GLEN
R3A PLASMA CLEANER |
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This system is PLC controlled and, like the G1000
system, offers real-time English readout of system operating parameters
together with remedial action in the event of an abort.
This 500 Watt system has two 14 x 14-inch electrode
sets which can be quickly configured to provide any of the three plasma
modes listed in the "General Overview" section. The system can
be operated in a single or dual plasma sequence with two computer selected
plasma gas inputs and a connection for a backfill gas (typically
nitrogen).
The system has RS 232 as standard; it is CE compliant
and S2/S8 certified.
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SERVICE
AND RELIABILITY |
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The YES-Glen System is designed with
total reliability in mind. In the unlikely event that service is required,
both system drawers simply roll out from the main console. Only hard
plumbed vacuum fittings must be accessed from the rear of the system.
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FEATURES |
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YES-Glen R3A
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500 W
parallel plate plasma cleaner |
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Active, electron-free and RIE
Plasma modes |
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Two
(2), 14x14-in. electrode sets for 392 sq. in. capacity |
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Plain
English readout of process and diagnostics |
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Total
capacity = 390 sq. in. |
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Smallest
of the series |
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Pilot
run quantities
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PLASMA
SELECTION |
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Electron-free
for cleaning sensitive. electronic devices prior to wire bonding |
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Active
for etching and surface modification prior to bonding |
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RIE for
the most aggressive modification of material surfaces |
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NOTE: The
G1000 with the new temperature control and loop
program can ideally be used as a plasma stripper. It takes about 1 hour of
continuous plasma to remove 1 micron of resist.
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YES-Glen
designs and manufactures a line of PLC controlled plasma
cleaning equipment for cleaning and surface modification for many
industries including Semiconductor, Medical, Biochip, Optical and more.
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YES-Glen
product lines form one of the most
comprehensive product ranges in the industry. Systems are available for
applications ranging from small volume R&D through higher volume
production quantities. Sample sizes range from flat panels to the smallest
semiconductor devices. Each system offers quick interchange between five
basic operating modes:
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MILD ANISOTROPIC MODES |
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ISOTROPIC MODES |
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Downstream, or electron free mode is used for cleaning
sensitive electronic devices prior to wire bonding. Product is on a
floating tray outside the plasma generation volume. The plasma
passes through a grounded tray to the product, balancing the charged
species to limit surface charge buildup. |
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Active mode is used for etching and surface
modification prior to bonding applications. Product is on a grounded
tray inside the plasma generation area |
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for cleaning sensitive electronic components normally
associated with the semiconductor industry.
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Active Ion Trap is the most aggressive plasma for
reactive processes. Product is on an active tray outside the plasma
generation volume. Ion trap plasmas have high ion concentrations at
low energy levels. |
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Downstream Ion trap is for aggressive, electron free
cleaning. Product is on a grounded tray outside the plasma
generation volume.
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 The parallel plate design ensures uniformity of plasma
in all modes.
All RF, Vacuum and Gas control functions are safety
interlocked and the systems will shut down in a sealed mode in the event
of any parameter going outside preset limits.
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PLASMA
GAS FLOW |
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RIE
PLASMA FLOW |
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Click on picture to
enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)
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Click on picture to
enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)
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ACTIVE
PLASMA |
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DOWNSTREAM
ELECTRON-FREE PLASMA |
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Click on picture to
enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)
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Click on picture to
enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)
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