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BITA  Exhibitions Page

PRODUCTRONICA 2009

Productronica 2009

Links to Contacts, Exhibitions and News (click on text)
EXHIBITION OVERVIEW 

The Productronica 2009 will take place in Munich, November 10- 13, 2009. Preliminary, following of our suppliers will be present with machines, equipment etc.. 
NOTE: Ulf Berghman will be present at the exhibition from Tuesday morning until Friday afternoon. You can contact him at: 0046 70 594 4230 or leave a message by his hotel: 089 431 9760
 

 PRODUCT  BOOTH AND CONTACT
to ADT Products Pages

ADT
is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Hall B3
  Booth 473

Contact: Yossi Gershon or Nati Pelles.
Ms. Miri Benita will help you with Dicing Blade questions.

ADT is exhibiting their
new Semi Automatic dicing system 7900 Duo using two facing spindles.

 PRODUCT  BOOTH AND CONTACT
to AUREL Automation Products Page

AUREL
A
UREL Automation is specialized machines for material deposition and creation of precision-patterns. Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces for automatic production lines.

Hall A2
  Booth 481

Contact: Nerio Samori
Screen printers , stand alone, in-line, for thick film, LTCC, green energies, sensors. Lasers for trimming, marking, cutting. Work Cell for ink-jet of nano materials, microdispensing, DOD, inspections.

 PRODUCT  BOOTH AND CONTACT
to JFP Products Pages

JFP Microtechnic
Very new is the Model PP400 semiautomatic and PP400M manual Die Bonder, (however not shown at the exhibition, but could be discussed at the booth).

Hall A4
  Booth 309

Contact: François Palomares and Didier Magne,
JFP will show their Model PP5-6 Flip-Chip die bonder and PP-One, manual die placement.

 PRODUCT  BOOTH AND CONTACT

TPT HB05
HB05 is the latest updated bench top size manual wire bonder from TPT, easy to operate and ideal for laboratories, pilot and pre-production runs and small scale production lines.

Hall B3
  Booth 183

Contact: Franz Hickmann or Michael Gross
TPT displays their product line of wire bonders, including the new HB05 and H80, "Pick & Place/Die Bonding option for Model HB16.

 PRODUCT  BOOTH AND CONTACT
to UniTemp Products Pages

UniTemp
Thermal Process ovens for laboratory and pre-production requirement. Hotplates/workstages (workholders). The BT Bond Tester is probably, the lowest cost destructive/ non-destructive pull tester in the market.

Hall B3
  Booth 183

Contact: Wilhelm Bachmann and Astrid Schmid
UniTemp will exhibit their UTP-1100, RTP-1200, Hot Plates (workstages/ workholders), RSS-350, Leak detector and the BT Bond Pull Tester.

 PRODUCT  BOOTH AND CONTACT
to WAM Products Pages

WILLIAMS ADVANCED METALS
Vapor deposition materials, backing plates and PVD accessories to bonding wire, frame/lid assemblies, solder and brazing materials.

Hall A2
  Booth 361

Contact: John Regan
Williams Advanced Metals will be by their German representative, Dage. WAM will exhibiting Combo Lids, wire, preforms and PVD products

 PRODUCT  BOOTH AND CONTACT
to XYZTec Products Pages

XYZTEC
Multifunctional Bond Testers with an innovative mechanical design. Motorized X, Y Z stage 190mm travel on all models. Controlled by two ergonomically designed joysticks

Hall A2
  Booth 567

Contact: Dirk Schade
XYZTEC will exhibit their Model Condor 150-3 Bond Tester.

For more information contact:

 

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Last modified: 2009-11-05