BITA  Exhibitions Page

The SMT/HYBRID/PACKAGING 2009 will take place in Nuremberg, June 8- 10, 2010. The below BITA suppliers will be present with machines, equipment etc.. 
NOTE: Ulf Berghman will be at the exhibition from Tuesday morning until Thursday afternoon. You can contact him at: 0046 70 594 4230 or leave a message by his hotel: 0049 911-232000.

JFP Microtechnic
JFP will show the PP5, Monozoom & Epoxy & Eutectic & Wafersystem as well as the PP1 system.

Contact: François Palomares and Didier Magne,
JFP will show their machines in the booth of Micronnect BV.

GTC
Gaiser Tool Company invented the first alumina ceramic capillary, revolutionizing wire bonding. Since that time, Gaiser Tool Company has become the industry leader.

Contact: Brigitta Wrana
She will help you in choosing the best tool for your application.

TPT HB05
HB05 is the latest updated bench top size manual wire bonder from TPT, easy to operate and ideal for laboratories, pilot and pre-production runs and small scale production lines

Contact: Franz Hickmann or Michael Gross
TPT displays their product line of wire bonders, including the new HB05 and H80, "Pick & Place/Die Bonding option for Model HB16.

UNITEMP
Have a line of Thermal Process ovens which are excellent for laboratory and pre-production requirement.

Contact: Astrid Schmid and Peter Hoffmann.
Note: you will find UniTemp in the booth of TPT/Amadyne with some of their products, (RSO-650, HP-155 and HP-60).

WILLIAMS ADVANCED METALS
Vapor deposition materials, backing plates and PVD accessories to bonding wire, frame/lid assemblies, solder and brazing materials.

Contact: John Regan
Williams will be present by their German representative, Dage. WAM is exhibiting Combo Lids, bonding wire, preforms and PVD products.