BMR TECHNOLOGY CORP.

Founded in 1997, BMR's mission is to be the industrial leader in the development of plasma-assisted equipment for thin film device fabrication. BMR's advanced plasma technology provides the advanced solutions required for today's tough thin film materials in various industries including:

BMR provides the equipment ideal for both initial process development and mass production. BMR engineers have extensive experience in semiconductor processing and semiconductor equipment design. Their experienced process engineering team focuses on optimizing the right system for each customer's toughest requirements.

DFS-200  

HiDep 

DFS-200
DFS-200, BMR Technology Corporation’s plasma asher, is a downstream plasma asher designed for plasma-damage-free photoresist ashing based on proprietary inductively coupled plasma technology.

HiDep
The HiDep™ System from BMR Technology opens a new horizon for plasma-enhanced chemical vapor deposition (PECVD). Based on BMR's patented Hybrid Electromagnetic Energy Coupling technology

HiEtch  

HiEtch
The HiEtch Processing System is using BMR's patented, proprietary Inductive Coupled Plasma (ICP) technology. HiEtch provides wide process windows covering HDP technology and many RIE processes.