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ABOUT ASM |
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ASM
PACIFIC TECHNOLOGY LTD.
ASM
is world’s number one assembly equipment manufacturer for the global
microelectronics industry, offering complete factory automation solutions
to customers for their assembly and packaging needs.
Benefits of selecting ASM:
More than 25 years experience in Semiconductors Industry. Advice customers
on packaging and process solutions. State-of-the-art technology. Cost
effective products. Total packaging solution (die and wire bonders, flip
chip, die sorters, snap curing ovens, dispensing and molding systems, trim
and form systems, solder ball attachment, CA BGA pick and place,
singulation system, test handler, integration), single responsibilities. Excellent
after-sales support and technical service. The
company have been acting in the microelectronic industry for more then 15
years. The key personal have 25 years of experience and as a result of
market demand developed a line of manual machines for unique applications. |
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PRODUCT OVERVIEW |
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We
have focused on the Die Bonder, Flip-Chip and Wire Bonder lines. ASM have
a large number of other machines covering basically the whole
Semi-conductor assembly range, like; Encapsulation (Molding), Trim / Form /
Singulation, Pick & Place,
Ball Attach, Integrated Line, Dispensing
System, LED Die Sorter and Mapping Sorter. To get direct
information of other systems, do visit:
ASM Pacific
Products |
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WAFER BUMP
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DIE BONDERS
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ASM "Hummingbird"
Stud Bumper
ASM
Hummingbird, the innovative solution to the increasing demand for stud
bumpers. A
further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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Model AD898 and AD 8912 Epoxy Die Bonders
The
ASM
Epoxy Die Bonders are designed for customers running up to 12 inch wafers
primarily with smaller die sizes. It provides the customer with
exceptional volume throughput with good placement accuracy. |
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WIRE BALL BONDERS |
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WIRE WEDGE BONDERS |
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Model EAGLE339-series, Harrier
and TwinEagle Ball Wire Bonders
ASM thermosonic wire ball bonder are for IC, hybrid, large size PCBs
and Chip-on-board (COB) applications. The machines are designed to meet today's equipment needs for higher speed
production of more difficult devices. |
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Model
AB520A and AB559A
Wedge Bonders
ASM
wedge bonders are designed for today's needs
for fast turn production of COB/PCB & LED Display devices. The bonders provides the user with a
bonding solution capable of handling fine pitch applications with high
speed and easy versatility. |
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FLIP-CHIP BONDERS |
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ASM Flip-Chip Die Bonders
The
Model AD900 and AD819
(High Precision) Series Flip-Chip Die Bonder for various application. Also,
check the in-line
Model SR900 Flux
Reflow Oven designed for in-line
solder paste reflow,
eutectic solder paste reflow, epoxy curing, snap-cure epoxy curing. |
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