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ASM PACIFIC TECHNOLOGY LTD.

ASM Home

ABOUT ASM 

ASM PACIFIC TECHNOLOGY LTD.
ASM is world’s number one assembly equipment manufacturer for the global microelectronics industry, offering complete factory automation solutions to customers for their assembly and packaging needs.
Benefits of selecting ASM:
More than 25 years experience in Semiconductors Industry. Advice customers on packaging and process solutions. State-of-the-art technology. Cost effective products. Total packaging solution (die and wire bonders, flip chip, die sorters, snap curing ovens, dispensing and molding systems, trim and form systems, solder ball attachment, CA BGA pick and place, singulation system, test handler, integration), single responsibilities.
Excellent after-sales support and technical service. The company have been acting in the microelectronic industry for more then 15 years. The key personal have 25 years of experience and as a result of market demand developed a line of manual machines for unique applications.

PRODUCT OVERVIEW 
We have focused on the Die Bonder, Flip-Chip and Wire Bonder lines. ASM have a large number of other machines covering basically the whole Semi-conductor assembly range, like; Encapsulation (Molding), Trim / Form / Singulation, Pick & Place, Ball Attach, Integrated Line, Dispensing System, LED Die Sorter and Mapping Sorter. To get direct information of other systems, do visit: ASM Pacific Products
WAFER BUMP DIE BONDERS
ASM "Hummingbird" Stud Bumper

ASM "Hummingbird" Stud Bumper 
ASM Hummingbird, the innovative solution to the increasing demand for stud bumpers. A further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

ASM Epoxy Die Bonder Line

Model AD898 and AD 8912 Epoxy Die Bonders 
The ASM Epoxy Die Bonders are designed for customers running up to 12 inch wafers primarily with smaller die sizes.  It provides the customer with exceptional volume throughput with good placement accuracy. 

WIRE BALL BONDERS WIRE WEDGE BONDERS
ASM Ball Wire Bonder Line

Model EAGLE339-series, Harrier
and TwinEagle
Ball Wire Bonders

ASM thermosonic wire ball bonder are for IC, hybrid, large size PCBs and Chip-on-board (COB) applications. The machines are designed to meet today's equipment needs for higher speed production of more difficult devices. 

ASM Wedge Wire Bonder Line

Model AB520A and AB559A Wedge Bonders
ASM wedge bonders are designed for today's needs for fast turn production of COB/PCB & LED Display devices. The bonders provides the user with a bonding solution capable of handling fine pitch applications with high speed and easy versatility.

FLIP-CHIP BONDERS
ASM Flip-Chip Bonder Line

ASM Flip-Chip Die Bonders  
The Model AD900 and AD819 (High Precision) Series Flip-Chip Die Bonder for various application. Also, check the in-line Model SR900 Flux Reflow Oven designed for in-line solder paste reflow, eutectic solder paste reflow, epoxy curing, snap-cure epoxy curing.

 

 

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Last modified: 2014-10-07